Solder: The metal or alloy used as a filler metal in soldering, which has a liquidus not exceeding 840ºF (450ºC) and below the solidus of the base metal.

 

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Solder: The metal or alloy used as a filler metal in soldering, which has a liquidus not exceeding 840ºF (450ºC) and below the solidus of the base metal.

Methylacetylene Propadiene: A family of alternative fuel gases that are mixtures of two or more gases (propane, butane, butadiene, methylacetylene and propadiene). Methylacetylene propadiene is used for oxyfuel cutting . . . View Full Definition

Plumbing Rough: Work performed by the plumbing contractor after the Rough Heat is installed. This work includes installing all plastic ABS drain and waste lines, copper water lines, bath tubs, shower pans, . . . View Full Definition

Capillary Action: The force by which liquid in contact with a solid is distributed between closely fitted faying surfaces of the joint to be brazed or soldered.

Filler Material: The material, metal, or alloy to be added in making a welded, brazed, or soldered joint.

Joint Clearance: The distance between the faying surfaces of a joint in brazing or soldering.

Noncorrosive Flux: A soldering flux that in either its original or residual form does not chemically attack the base metal. It usually is composed of rosin-based materials.

Lead (Pb): Atomic number: 82, Atomic mass: 207.2 g.mol -1, Electronegativity: 1.8, Density: 11.34 g.cm-3 at 20°C, Melting point: 327 °C, Boiling point: 1755 °C, Vanderwaals radius: 0.154 nm, Ionic radi . . . View Full Definition

Gold (Au): Atomic number: 79, Atomic mass: 196.9655 g.mol -1, Electronegativity ccording to Pauling: 2.4, Density: 19.3 g.cm-3 at 20°C, Melting point: 1062 °C, Boiling point: 2000 °C, Vanderwaals radiu . . . View Full Definition

Tin (Sn): Atomic number: 50, Atomic mass: 118.69 g.mol -1, Electronegativity: 1.8, Density: 5.77g.cm-3 (alpha) and 7.3 g.cm-3 at 20°C (beta), Melting point: 232 °C, Boiling point: 2270 °C, Vanderwaals . . . View Full Definition